| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kituo | Through Board |
| Kipenyo cha Shimo | 0.046" ~ 0.051" (1.17mm ~ 1.30mm) |
| Kipenyo cha Insulation | 0.060" (1.52mm) |
| Urefu - Kwa ujumla | 0.246" (6.24mm) |
| Kupima waya | 22-26 AWG |
| Nyenzo ya Mawasiliano | Phosphor Bronze |
| Wasiliana kumaliza | Tin |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
