| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Andika | Board Level |
| Kifurushi kilichopozwa | Pentium® III (Thin) |
| Njia ya Kiambatisho | Clip |
| Sura | Rectangle |
| Urefu | 2.520" (64.00mm) |
| Upana | 2.000" (50.80mm) |
| Kipenyo | - |
| Urefu wa Msingi (Urefu wa Fin) | 1.220" (31.00mm) |
| Upunguzaji wa Nguvu @ Joto Kupanda | - |
| Upinzani wa joto @ Mtiririko wa hewa uliolazimishwa | 1.15°C/W |
| Upinzani wa joto @ Asili | - |
| Nyenzo | Aluminum, Plastic |
| Nyenzo Maliza | - |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
