| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Andika | Board Level |
| Kifurushi kilichopozwa | BGA |
| Njia ya Kiambatisho | Thermal Tape, Adhesive (Not Included) |
| Sura | Square, Fins |
| Urefu | 0.655" (16.64mm) |
| Upana | 0.655" (16.64mm) |
| Kipenyo | - |
| Urefu wa Msingi (Urefu wa Fin) | 0.265" (6.73mm) |
| Upunguzaji wa Nguvu @ Joto Kupanda | 1.0W @ 40°C |
| Upinzani wa joto @ Mtiririko wa hewa uliolazimishwa | 17.50°C/W @ 300 LFM |
| Upinzani wa joto @ Asili | - |
| Nyenzo | Aluminum |
| Nyenzo Maliza | Black Anodized |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
