| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Andika | Board Level |
| Kifurushi kilichopozwa | BGA |
| Njia ya Kiambatisho | Thermal Tape, Adhesive (Not Included) |
| Sura | Cylindrical |
| Urefu | - |
| Upana | - |
| Kipenyo | 0.300" (7.62mm) ID, 1.125" (28.57mm) OD |
| Urefu wa Msingi (Urefu wa Fin) | - |
| Upunguzaji wa Nguvu @ Joto Kupanda | 1.5W @ 40°C |
| Upinzani wa joto @ Mtiririko wa hewa uliolazimishwa | 8.00°C/W @ 400 LFM |
| Upinzani wa joto @ Asili | - |
| Nyenzo | Aluminum |
| Nyenzo Maliza | Black Anodized |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
