| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Andika | Top Mount |
| Kifurushi kilichopozwa | TO-252 (DPak) |
| Njia ya Kiambatisho | SMD Pad |
| Sura | Rectangular, Fins |
| Urefu | 0.315" (8.00mm) |
| Upana | 0.900" (22.86mm) |
| Kipenyo | - |
| Urefu wa Msingi (Urefu wa Fin) | 0.400" (10.16mm) |
| Upunguzaji wa Nguvu @ Joto Kupanda | 0.8W @ 30°C |
| Upinzani wa joto @ Mtiririko wa hewa uliolazimishwa | 12.50°C/W @ 600 LFM |
| Upinzani wa joto @ Asili | 15.00°C/W |
| Nyenzo | Copper |
| Nyenzo Maliza | Tin |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
