| Andika | Maelezo. |
| Hali ya Sehemu | Obsolete |
|---|---|
| Andika | Board Level |
| Kifurushi kilichopozwa | TO-263 (D²Pak) |
| Njia ya Kiambatisho | SMD Pad |
| Sura | Rectangular, Fins |
| Urefu | 0.590" (15.00mm) |
| Upana | 1.020" (25.91mm) |
| Kipenyo | - |
| Urefu wa Msingi (Urefu wa Fin) | 0.375" (9.52mm) |
| Upunguzaji wa Nguvu @ Joto Kupanda | 2.0W @ 40°C |
| Upinzani wa joto @ Mtiririko wa hewa uliolazimishwa | 5.00°C/W @ 400 LFM |
| Upinzani wa joto @ Asili | - |
| Nyenzo | Copper |
| Nyenzo Maliza | Tin |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
