| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Andika | Top Mount |
| Kifurushi kilichopozwa | Assorted (BGA, LGA, CPU, ASIC...) |
| Njia ya Kiambatisho | Thermal Tape, Adhesive (Included) |
| Sura | Square, Fins |
| Urefu | 0.890" (22.61mm) |
| Upana | 0.890" (22.61mm) |
| Kipenyo | - |
| Urefu wa Msingi (Urefu wa Fin) | 0.457" (11.60mm) |
| Upunguzaji wa Nguvu @ Joto Kupanda | - |
| Upinzani wa joto @ Mtiririko wa hewa uliolazimishwa | 4.62°C/W @ 200 LFM |
| Upinzani wa joto @ Asili | 14.12°C/W |
| Nyenzo | Aluminum Alloy |
| Nyenzo Maliza | Black Anodized |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
