Andika | Maelezo. |
Hali ya Sehemu | Obsolete |
---|---|
Andika | Top Mount |
Kifurushi kilichopozwa | Assorted (BGA, LGA, CPU, ASIC...) |
Njia ya Kiambatisho | Thermal Tape, Adhesive (Not Included) |
Sura | Square, Pin Fins |
Urefu | 1.560" (39.62mm) |
Upana | 1.560" (39.62mm) |
Kipenyo | - |
Urefu wa Msingi (Urefu wa Fin) | 0.457" (11.60mm) |
Upunguzaji wa Nguvu @ Joto Kupanda | - |
Upinzani wa joto @ Mtiririko wa hewa uliolazimishwa | 2.80°C/W @ 200 LFM |
Upinzani wa joto @ Asili | - |
Nyenzo | Aluminum |
Nyenzo Maliza | Black Anodized |
Hali ya RoHS. | Rohs inakubaliana. |
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Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
Stock Jamii. | Inapatikana hisa. |