| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Andika | Top Mount |
| Kifurushi kilichopozwa | Assorted (BGA, LGA, CPU, ASIC...) |
| Njia ya Kiambatisho | Thermal Tape, Adhesive (Included) |
| Sura | Square, Pin Fins |
| Urefu | 1.810" (45.97mm) |
| Upana | 1.810" (45.97mm) |
| Kipenyo | - |
| Urefu wa Msingi (Urefu wa Fin) | 0.605" (15.37mm) |
| Upunguzaji wa Nguvu @ Joto Kupanda | - |
| Upinzani wa joto @ Mtiririko wa hewa uliolazimishwa | 2.80°C/W @ 400 LFM |
| Upinzani wa joto @ Asili | 8.10°C/W |
| Nyenzo | Aluminum |
| Nyenzo Maliza | Black Anodized |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
