| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Andika | Board Level |
| Kifurushi kilichopozwa | Intel LGA775 CPU Cooler |
| Njia ya Kiambatisho | Clip |
| Sura | Round |
| Urefu | - |
| Upana | - |
| Kipenyo | 3.543" (90.00mm) OD |
| Urefu wa Msingi (Urefu wa Fin) | 1.811" (46.00mm) |
| Upunguzaji wa Nguvu @ Joto Kupanda | - |
| Upinzani wa joto @ Mtiririko wa hewa uliolazimishwa | - |
| Upinzani wa joto @ Asili | 0.54°C/W |
| Nyenzo | Aluminum, Copper, Plastic |
| Nyenzo Maliza | - |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
