| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Andika | Top Mount |
| Kifurushi kilichopozwa | SMD |
| Njia ya Kiambatisho | SMD Pad |
| Sura | Rectangular, Fins |
| Urefu | 0.500" (12.70mm) |
| Upana | 1.220" (30.99mm) |
| Kipenyo | - |
| Urefu wa Msingi (Urefu wa Fin) | 0.400" (10.16mm) |
| Upunguzaji wa Nguvu @ Joto Kupanda | - |
| Upinzani wa joto @ Mtiririko wa hewa uliolazimishwa | 16.00°C/W @ 600 LFM |
| Upinzani wa joto @ Asili | 50.00°C/W |
| Nyenzo | Copper |
| Nyenzo Maliza | Solderable |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
