| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Andika | Heat Spreader |
| Kifurushi kilichopozwa | Assorted (BGA, LGA, CPU, ASIC...) |
| Njia ya Kiambatisho | Adhesive |
| Sura | Rectangular |
| Urefu | 4.000" (101.60mm) |
| Upana | 1.000" (25.40mm) |
| Kipenyo | - |
| Urefu wa Msingi (Urefu wa Fin) | 0.008" (0.21mm) |
| Upunguzaji wa Nguvu @ Joto Kupanda | - |
| Upinzani wa joto @ Mtiririko wa hewa uliolazimishwa | - |
| Upinzani wa joto @ Asili | - |
| Nyenzo | Copper |
| Nyenzo Maliza | Polyester |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
