| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kituo | Through Board |
| Kipenyo cha Shimo | 0.071" (1.80mm) |
| Kipenyo cha Insulation | 0.059" ~ 0.118" (1.50mm ~ 3.00mm) |
| Urefu - Kwa ujumla | 0.299" (7.59mm) |
| Kupima waya | 18-22 AWG |
| Nyenzo ya Mawasiliano | Brass |
| Wasiliana kumaliza | Tin |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
