| Andika | Maelezo. |
| Hali ya Sehemu | Active |
|---|---|
| Aina ya Kituo | Through Board |
| Kipenyo cha Shimo | 0.140" (3.55mm) |
| Kipenyo cha Insulation | 0.157" ~ 0.165" (3.99mm ~ 4.19mm) |
| Urefu - Kwa ujumla | 0.362" (9.19mm) |
| Kupima waya | 12 AWG |
| Nyenzo ya Mawasiliano | Brass |
| Wasiliana kumaliza | Tin |
| Hali ya RoHS. | Rohs inakubaliana. |
|---|---|
| Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
| Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
| Stock Jamii. | Inapatikana hisa. |
