Andika | Maelezo. |
Hali ya Sehemu | Active |
---|---|
Andika | Wire Solder |
Muundo | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Kipenyo | 0.008" (0.20mm) |
Kiwango cha kuyeyuka | 423 ~ 428°F (217 ~ 220°C) |
Aina ya Flux | No-Clean, Water Soluble |
Kupima waya | 32 AWG, 35 SWG |
Mchakato | Lead Free |
Fomu | Spool, 1.76 oz (50g) |
Maisha ya rafu | - |
Anza maisha ya rafu | - |
Uhifadhi / Jokofu Joto | - |
Hali ya RoHS. | Rohs inakubaliana. |
---|---|
Ngazi ya unyeti wa unyevu (MSL) | Haitumiki |
Hali ya LifeCycle. | Kizamani / mwisho wa maisha. |
Stock Jamii. | Inapatikana hisa. |