Soketi za IC, Transistors

SIP1X08-011BLF

SIP1X08-011BLF

Sehemu ya hisa.: 3851

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 8 (1 x 8), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP1X02-011BLF

SIP1X02-011BLF

Sehemu ya hisa.: 3976

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 2 (1 x 2), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SPF080-1X08-998Z

SPF080-1X08-998Z

Sehemu ya hisa.: 4077

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 8 (1 x 8), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin-Lead, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm),

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DIP324-011BLF

DIP324-011BLF

Sehemu ya hisa.: 3957

Andika: DIP, 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 24 (2 x 12), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X04-157BLF

SIP050-1X04-157BLF

Sehemu ya hisa.: 3981

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 4 (1 x 4), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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DPF308-998Z

DPF308-998Z

Sehemu ya hisa.: 4268

Andika: DIP, 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 8 (2 x 4), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin-Lead, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X22-160BLF

SIP050-1X22-160BLF

Sehemu ya hisa.: 4158

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 22 (1 x 22), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X11-157BLF

SIP050-1X11-157BLF

Sehemu ya hisa.: 4043

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 11 (1 x 11), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP41430-001LF

SIP41430-001LF

Sehemu ya hisa.: 9907

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 2 (1 x 2), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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DILB40P-223TLF

DILB40P-223TLF

Sehemu ya hisa.: 126353

Andika: DIP, 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 40 (2 x 20), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 100.0µin (2.54µm), Nyenzo ya Mawasiliano - Kuchumbiana: Copper Alloy,

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SIP050-1X03-157BLF

SIP050-1X03-157BLF

Sehemu ya hisa.: 4139

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 3 (1 x 3), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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DIP632-001BLF

DIP632-001BLF

Sehemu ya hisa.: 3932

Andika: DIP, 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 32 (2 x 16), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP1X20-011BLF

SIP1X20-011BLF

Sehemu ya hisa.: 9684

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 20 (1 x 20), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP1X05-041BLF

SIP1X05-041BLF

Sehemu ya hisa.: 4003

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 5 (1 x 5), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP1X09-001BLF

SIP1X09-001BLF

Sehemu ya hisa.: 3864

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 9 (1 x 9), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP1X05-011BLF

SIP1X05-011BLF

Sehemu ya hisa.: 3821

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 5 (1 x 5), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X21-160BLF

SIP050-1X21-160BLF

Sehemu ya hisa.: 4268

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 21 (1 x 21), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X23-160BLF

SIP050-1X23-160BLF

Sehemu ya hisa.: 4165

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 23 (1 x 23), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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DIP324-001BLF

DIP324-001BLF

Sehemu ya hisa.: 9708

Andika: DIP, 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 24 (2 x 12), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP1X32-014BLF

SIP1X32-014BLF

Sehemu ya hisa.: 8411

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 32 (1 x 32), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 150.0µin (3.81µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X17-160BLF

SIP050-1X17-160BLF

Sehemu ya hisa.: 8445

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 17 (1 x 17), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X26-157BLF

SIP050-1X26-157BLF

Sehemu ya hisa.: 4109

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 26 (1 x 26), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X30-157BLF

SIP050-1X30-157BLF

Sehemu ya hisa.: 4208

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 30 (1 x 30), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X15-160BLF

SIP050-1X15-160BLF

Sehemu ya hisa.: 4160

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 15 (1 x 15), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X05-157BLF

SIP050-1X05-157BLF

Sehemu ya hisa.: 4045

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 5 (1 x 5), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SPF080-1X10-998Z

SPF080-1X10-998Z

Sehemu ya hisa.: 4094

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 10 (1 x 10), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin-Lead, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm),

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SIP050-1X25-157BLF

SIP050-1X25-157BLF

Sehemu ya hisa.: 4155

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 25 (1 x 25), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X31-157BLF

SIP050-1X31-157BLF

Sehemu ya hisa.: 4312

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 31 (1 x 31), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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DPF314-998Z

DPF314-998Z

Sehemu ya hisa.: 4242

Andika: DIP, 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 14 (2 x 7), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin-Lead, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X06-160BLF

SIP050-1X06-160BLF

Sehemu ya hisa.: 4131

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 6 (1 x 6), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP1X08-001BLF

SIP1X08-001BLF

Sehemu ya hisa.: 8449

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 8 (1 x 8), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X32-157BLF

SIP050-1X32-157BLF

Sehemu ya hisa.: 4235

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 32 (1 x 32), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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DPF316-998Z

DPF316-998Z

Sehemu ya hisa.: 4323

Andika: DIP, 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 16 (2 x 8), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin-Lead, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X28-157BLF

SIP050-1X28-157BLF

Sehemu ya hisa.: 8439

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 28 (1 x 28), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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DILB24P-224TLF

DILB24P-224TLF

Sehemu ya hisa.: 154728

Andika: DIP, 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 24 (2 x 12), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin-Lead, Wasiliana Kumaliza Unene - Kupandana: 100.0µin (2.54µm), Nyenzo ya Mawasiliano - Kuchumbiana: Copper Alloy,

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SIP050-1X16-160BLF

SIP050-1X16-160BLF

Sehemu ya hisa.: 4123

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 16 (1 x 16), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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