Soketi za IC, Transistors | Viunganishi, Viunganishi | 5

SIP1X16-041BLF

Sehemu ya hisa.: 4311

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 16 (1 x 16), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Amphenol ICC (FCI)

SIP1X10-011BLF

Sehemu ya hisa.: 3857

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 10 (1 x 10), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Amphenol ICC (FCI)

DIP640-011BLF

Sehemu ya hisa.: 9661

Andika: DIP, 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 40 (2 x 20), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X14-160BLF

Sehemu ya hisa.: 9689

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 14 (1 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Amphenol ICC (FCI)

DIP306-001BLF

Sehemu ya hisa.: 4025

Andika: DIP, 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 6 (2 x 3), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X10-157BLF

Sehemu ya hisa.: 9712

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 10 (1 x 10), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Amphenol ICC (FCI)

SIP1X06-001BLF

Sehemu ya hisa.: 3850

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 6 (1 x 6), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X15-157BLF

Sehemu ya hisa.: 4221

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 15 (1 x 15), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Amphenol ICC (FCI)

SIP1X04-011BLF

Sehemu ya hisa.: 3843

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 4 (1 x 4), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Amphenol ICC (FCI)

DIP314-001BLF

Sehemu ya hisa.: 4020

Andika: DIP, 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 14 (2 x 7), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Amphenol ICC (FCI)

DIP050-628-160BLF

Sehemu ya hisa.: 4036

Andika: DIP, 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 28 (2 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X22-157BLF

Sehemu ya hisa.: 4177

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 22 (1 x 22), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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Amphenol ICC (FCI)

SIP050-1X17-157BLF

Sehemu ya hisa.: 4072

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 17 (1 x 17), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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