Soketi za IC, Transistors

SIP1X10-001BLF

SIP1X10-001BLF

Sehemu ya hisa.: 3982

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 10 (1 x 10), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X05-160BLF

SIP050-1X05-160BLF

Sehemu ya hisa.: 4087

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 5 (1 x 5), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X03-160BLF

SIP050-1X03-160BLF

Sehemu ya hisa.: 8422

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 3 (1 x 3), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP1X27-001BLF

SIP1X27-001BLF

Sehemu ya hisa.: 3910

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 27 (1 x 27), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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DILB24P-223TLF

DILB24P-223TLF

Sehemu ya hisa.: 104134

Andika: DIP, 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 24 (2 x 12), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin-Lead, Wasiliana Kumaliza Unene - Kupandana: 100.0µin (2.54µm), Nyenzo ya Mawasiliano - Kuchumbiana: Copper Alloy,

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DIP316-001BLF

DIP316-001BLF

Sehemu ya hisa.: 4039

Andika: DIP, 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 16 (2 x 8), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X20-157BLF

SIP050-1X20-157BLF

Sehemu ya hisa.: 4087

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 20 (1 x 20), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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DILB16P-223TLF

DILB16P-223TLF

Sehemu ya hisa.: 172524

Andika: DIP, 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 16 (2 x 8), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 100.0µin (2.54µm), Nyenzo ya Mawasiliano - Kuchumbiana: Copper Alloy,

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SIP1X10-041BLF

SIP1X10-041BLF

Sehemu ya hisa.: 4148

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 10 (1 x 10), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X23-157BLF

SIP050-1X23-157BLF

Sehemu ya hisa.: 4182

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 23 (1 x 23), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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DILB8P-223TLF

DILB8P-223TLF

Sehemu ya hisa.: 101518

Andika: DIP, 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 8 (2 x 4), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 100.0µin (2.54µm), Nyenzo ya Mawasiliano - Kuchumbiana: Copper Alloy,

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DILB42P-223TLF

DILB42P-223TLF

Sehemu ya hisa.: 155017

Andika: DIP, 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 42 (2 x 21), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin-Lead, Wasiliana Kumaliza Unene - Kupandana: 100.0µin (2.54µm), Nyenzo ya Mawasiliano - Kuchumbiana: Copper Alloy,

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SIP1X03-011BLF

SIP1X03-011BLF

Sehemu ya hisa.: 3866

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 3 (1 x 3), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X27-157BLF

SIP050-1X27-157BLF

Sehemu ya hisa.: 4004

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 27 (1 x 27), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP1X11-011BLF

SIP1X11-011BLF

Sehemu ya hisa.: 9648

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 11 (1 x 11), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X27-160BLF

SIP050-1X27-160BLF

Sehemu ya hisa.: 9704

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 27 (1 x 27), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP1X14-011BLF

SIP1X14-011BLF

Sehemu ya hisa.: 3903

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 14 (1 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP1X07-011BLF

SIP1X07-011BLF

Sehemu ya hisa.: 3796

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 7 (1 x 7), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X09-157BLF

SIP050-1X09-157BLF

Sehemu ya hisa.: 4041

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 9 (1 x 9), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP1X20-001BLF

SIP1X20-001BLF

Sehemu ya hisa.: 4020

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 20 (1 x 20), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X02-157BLF

SIP050-1X02-157BLF

Sehemu ya hisa.: 4046

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 2 (1 x 2), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X32-160BLF

SIP050-1X32-160BLF

Sehemu ya hisa.: 4141

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 32 (1 x 32), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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DIP318-011BLF

DIP318-011BLF

Sehemu ya hisa.: 4004

Andika: DIP, 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 18 (2 x 9), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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DILB32P-223TLF

DILB32P-223TLF

Sehemu ya hisa.: 172195

Andika: DIP, 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 32 (2 x 16), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin-Lead, Wasiliana Kumaliza Unene - Kupandana: 100.0µin (2.54µm), Nyenzo ya Mawasiliano - Kuchumbiana: Copper Alloy,

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DIP316-011BLF

DIP316-011BLF

Sehemu ya hisa.: 3923

Andika: DIP, 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 16 (2 x 8), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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DIP328-011BLF

DIP328-011BLF

Sehemu ya hisa.: 3978

Andika: DIP, 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 28 (2 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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DIP624-011BLF

DIP624-011BLF

Sehemu ya hisa.: 3848

Andika: DIP, 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 24 (2 x 12), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X18-157BLF

SIP050-1X18-157BLF

Sehemu ya hisa.: 4012

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 18 (1 x 18), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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DIP640-001BLF

DIP640-001BLF

Sehemu ya hisa.: 3891

Andika: DIP, 0.6" (15.24mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 40 (2 x 20), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X07-157BLF

SIP050-1X07-157BLF

Sehemu ya hisa.: 4104

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 7 (1 x 7), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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DIP324-014BLF

DIP324-014BLF

Sehemu ya hisa.: 3912

Andika: DIP, 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 24 (2 x 12), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 100.0µin (2.54µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X24-160BLF

SIP050-1X24-160BLF

Sehemu ya hisa.: 4128

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 24 (1 x 24), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X10-160BLF

SIP050-1X10-160BLF

Sehemu ya hisa.: 4101

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 10 (1 x 10), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 30.0µin (0.76µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP1X16-011BLF

SIP1X16-011BLF

Sehemu ya hisa.: 9632

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 16 (1 x 16), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Gold, Wasiliana Kumaliza Unene - Kupandana: 10.0µin (0.25µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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DIP328-014BLF

DIP328-014BLF

Sehemu ya hisa.: 3950

Andika: DIP, 0.3" (7.62mm) Row Spacing, Idadi ya Vyeo au Pini (Gridi): 28 (2 x 14), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 100.0µin (2.54µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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SIP050-1X16-157BLF

SIP050-1X16-157BLF

Sehemu ya hisa.: 4245

Andika: SIP, Idadi ya Vyeo au Pini (Gridi): 16 (1 x 16), Lami - Kuoana: 0.100" (2.54mm), Wasiliana Kumaliza - Kuchumbiana: Tin, Wasiliana Kumaliza Unene - Kupandana: 200.0µin (5.08µm), Nyenzo ya Mawasiliano - Kuchumbiana: Beryllium Copper,

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